TCS8000 – 8.0 W/mK

TCS8000 –High Performance Thermally Conductive Silicon Pad
TCS8000 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Category:

TCS8000 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features & Benefit

  • Thermal conductivity 8.0 W/m-K
  • High Thermal Conductivity
  • Natural tacky
  • Good Electrically isolating
  • Easy to assembly
Property  Data Test Method
Composition   Silicone elastomer  
Color   Grey Visual
Thermal conductive  8.0W.m-1.K-1 ASTM D5470
Hardness   35~70 Shore 00 ASTM D2240
Density   3.5g.cm-3 ASTM D792
Temperature Range -40+200
Breakdown Voltage (V/mm) >6000 V ASTM D149
Flame Rating UL 94 V-0 UL 94
Dielectric Constant  12.6MHz ASTM D150
Standard Sheet Size  300*400 mm
Volume Resistivity   0.72*1013 ohm-cm ASTM D257
Tensile Strength  32Psi ASTM D412

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