LMG – 80000

LMG8000 is a thermally conductive liquid metal compound designed for use as a thermal interface material between the computer processor and the copper-based heat-sink or other high watt density applications. LMG8000 is benefit from the extremely great thermal conductivity and it will wets-out the thermal interface surfaces to produce low thermal impedance under low pressure.

Features & Benefit

— Thermal impedance: 0.06°C/W @ 50 psi

— Good compressibility

— High performance thermal Interface grease for copper-based heat sinks

Application Method

— Pre-clean heat sink and component interface with isopropyl alcohol prior to assembly or repair

— Ensure heat sink is dry before applying LMG8000

— LMG8000 thermal grease onto the processor or copper based heat-sink surface

— Assemble the processor and heat sink with clip or constant-pressure fasteners