LMPC – 8000

LMPC8000 heat conductive interface material is a kind of phase change liquid metal material. Under the ambient temperature the solid structure is benefit for assembling . Once reaching melting temperature the low thermal impendence feature will boost the efficiency of heat dissipation and decrease the electronic module temperature rapidly. LMPC8000 is widely design on electronic and electrical products, include IGBT, RF, TIM, GPU and CPU etc. LMPC8000 has excellent performance under long-term working, and the non-silicon formula will not have the silicon leakage risk.

Features & Benefit

— Thermal impedance: 0.063°C/W(@50 psi, 0.10mm)

— Eliminates processing constraints

— Easy handling for assembling on multiple components