TG1000 is a thermally conductive grease compound designed for use as a thermal interface material between a high-power electronic component and a heat sink TG1000 compound wet out the thermal interfaces and produce very low thermal impedance. The compound is able to cool the electronic components quickly and efficiently, in order to extend their shelf life and improve reliability. TG1000 is highly stable from -20℃ to 130℃ and has good weather ability as well as dielectric properties.
Features & Benefit
— Low thermal impedance
— Good thixotropy, operating easily
— Good crumpling resistance, high reliability in long-term work
| Property | Typical Value | Test Method | ||||
| Color | White | Visual | ||||
| Density (g/cc) | 2.2 | ASTM D792 | ||||
| Continuous Using Temperature (℃) | -20~130 | |||||
| Thermal Efficiency | ||||||
| Thermal Conductivity (W/mK) | 1 | ASTM D5470 | ||||
| Thermal Impendence VS. Pressure (Reference Sample: 0.1mm/Thickness) | ||||||
| Pressure (psi) | 10 |
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| Thermal Impedance ( ℃·in 2 /W ) | 0.074 |
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