TG6500 is a thermally conductive grease compound designed for use as a thermal interface material between the high-power electronic component and the heat sink. TG6500 compound is made by nano-grade powder with very low thermal impedance. The compound is able to cool the electronic components quickly and efficiently, in order to extend their shelf life and improve reliability. TG6500 is highly stabile from -20℃ to 125℃, and has good dielectric properties, in addition to the good thermal conductivity, which will not produce the pressure when use.
Features & Benefit
— Low thermal impedance, high thermal conductivity: 6.5 W/mK
— Good thixotropy, operating easily
— Good crumpling resistance, high reliability in long-term work
| Property | Typical Value | Test Method | ||||
| Color | Gray | Visual | ||||
| Density (g/cc) | 3.5 | ASTM D792 | ||||
| Continuous Using Temperature (℃) | -25~125 | |||||
| Thermal Efficiency | ||||||
| Thermal Conductivity (W/mK) | 6.5 | ASTM D5470 | ||||
| Thermal Impendence VS. Pressure (Reference Sample: 0.1mm/Thickness) | ||||||
| Pressure (psi) | 10 |
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| Thermal Impedance ( ℃·in 2 /W ) | 0.063 |
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