TG3000 is a thermally conductive grease compound designed for use asa thermal interface material between a high-power electronic componentand a heat sinkTG3000 compound wet out the thermal interfaces and produce very lowthermal impedance .The compound is able to cool the electroniccomponents quickly and efficiently , in order to extend their shelf life andimprove reliability.TG3000 is highly stable from -20 to 130 ℃and has good weather abilityas well as dielectric properties.
Features & Benefit
— Low thermal impedance with thermal conductive 3W/mK
— Good thixotropy, operating easily
— Good crumpling resistance, high reliability in long-term work
| Property | Typical Value | Test Method | |||
| Color | Gray | Visual | |||
| Density (g/cc) | 3.0 | ASTM D792 | |||
| Continuous Using Temperature(℃) | -20~130 | ||||
| Thermal Efficiency | |||||
| Thermal Conductivity (W/mK) | 3 | ASTM D5470 | |||
| Thermal Impendence VS. Pressure (Reference Sample :0.1mm/Thickness) | |||||
| Pressure (psi) | 10 | 25 | 50 | 60 | 80 |
| Thermal Impedance(( ℃·in 2 /W ) | 0.07 | 0.067 | 0.059 | 0.051 | 0.044 |
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