TCS1500 1.5 W/m-K

TCS1500 –High Performance Thermally Conductive Silicon Pad
TCS1500 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.

Category:

TCS1500 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.

Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features and Benefits

  • Thermal conductivity 1.5 W/m-K
  • Very soft & high compressibility
  • Natural tacky
  • Good Electrically isolating
  • Easy to assembly
Property  Data Test Method
Composition Silicone elastomer  
Color Multi-color Visual
Thermal conductive 1.5W.m-1.K-1 ASTM D5470
Hardness 10~60 Shore 00 ASTM D2240
Density 2.05g.cm-3 ASTM D792
Temperature Range -40℃~+200℃
Breakdown Voltage (V/mm) >10000 V ASTM D149
Flame Rating UL 94 V-0 UL 94
Dielectric Constant @1MHz 3.9 ASTM D150
Standard Sheet Size 300*400 mm
Volume Resistivity 3.0*1013 ohm-cm ASTM D257
Tensile Strength 25Psi ASTM D412

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