TCS0120 12.0 W/mK

TCS0120–High Performance Thermally Conductive Silicon Pad
TCS0120 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Category:

TCS0120 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.

Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features and Benefits

  • Thermal conductivity 12.0 W/m-K
  • High Thermal Conductivity
  • Natural tacky
  • Good Electrically isolating
  • Easy to assembly
Property  Data Test Method
Composition   Silicone elastomer  
Color   Grey Visual
Thermal conductive  12.0W.m-1.K-1 ASTM D5470
Hardness   50~70 Shore 00 ASTM D2240
Density   3.0g.cm-3 ASTM D792
Temperature Range -40+180
Breakdown Voltage (V/mm) >6000 V ASTM D149
Flame Rating UL 94 V-0 UL 94
Dielectric Constant @ 1 MHz 7.84MHz ASTM D150
Standard Sheet Size  300*300 mm
Volume Resistivity   2.62*1012 ohm-cm ASTM D257
Tensile Strength  32Psi ASTM D412

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