GTSR Series thermally conductive interface materials are with electrical isolation property. It is especially suitable for applications where low mounting pressures for component clamping is required e.g. low component clamping forces for discrete semiconductors mounted with spring clips for a speedy assembling process .
The smooth and compliant surface characteristics of GTSR materials can minimize interfacial thermal resistance and maximize thermal performance for such applications.
Features and Benefits
- Thermal conductivity 1.6 W/m-K
- Good Electrically isolating
- Easy to assembly
- Wear resistance and voltage resistance
- High tear strength
- Surface non-tacky
Property | Data | Test Method |
Color | Pink/Gray | Visual |
Composition | Silicone elastomer | — |
Thickness(mm) | 0.23±0.03 | ASTM D374 |
Filler | Ceramic | — |
Carrier | Fiberglass | — |
Thermal conductive | 1.6W.m-1.K-1 | ASTM D5470 |
Hardness | 80 Shore A | ASTM D2240 |
Breakdown Voltage (V) | >4500V | ASTM D149 |
Dielectric Constant(1KHZ) | 6.0 | ASTM D150 |
Volume Resistivity | 1.0*1014 ohm-cm | ASTM D257 |
Tensile Strength | 6Mpa | ASTM D412 |
Elongation | 5% | ASTM D412 |
Temperature Range | -60℃~+240℃ | — |
Flame Rating | UL 94 V-0 | UL 94 |
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