GEL5000 is a high thermal performance, unique, fully cured thermal management solution for electronic assemblies, this material is not dry out. It has low viscosity for dispensing use application; this material have good tacky on the heat-sink can be used for application involving auto-dispensing equipment or stencil screen-printing.
It’s ideal for rework and field repair situations. Compare with thermal pad this material is can fully fill the gap and good compression, cost saving. GEL5000 is RoHS compliant and halogen-free, offering extra reassurance in applications where hazardous substances are forbidden.
Features & Benefit
— Low thermal impedance with thermal conductive 5.0W/mK
— Fill large gaps while providing superior thermally transferability
— Good crumpling resistance, high reliability in long-term work
— Working perfectly on the irregular structure gap
Packing Information
- 30CC syring
- 55CC syring
- 100CC syring
- 300CC cartridge
- 25KG pail
| Property | Data | Test Method |
| Thermal conductive | 5.0W.m-1.K-1 | ASTM D5470 |
| Color | Multi-color | Visual |
| Flow Rate, 30cc syringe with no tip attachment 0.100” orifice, 90psi | 55 g/min | — |
| Density | 3.1g.cm-3 | ASTM D792 |
| Minimum bond line thickness (mm) | 0.1 | — |
| Temperature Range | -55℃～+200℃ | — |
| Breakdown Voltage (V/mm) | >8000 V | ASTM D149 |
| Volume Resistivity | 1013 ohm-cm | ASTM D257 |
| Flammability Rating | V-0 | UL 94 |
| RoHS Compliant | Yes | — |
Reviews
There are no reviews yet.