application​

VRAM of VGA card thermal solution

With the increase of GPU core number and processing speed, the processing efficiency of VGA card needs flash memory with large storage space to provide more high-definition image quality and smooth using frequency.
The high temperature generated by the operation process will greatly affect the user’s comfort.
Antiowinner’s TCS thermal conductive silicone PAD products, with excellent softness and efficient thermal conductivity, can effectively reduce the working temperature of the module,significantly improve the smoothness of the display card, and give users higher sensory enjoyment.

TCS Series-High Performance Thermally Conductive Silicon PAD

GPU of VGA card thermal solution​

With the development of science and technology, the core number of GPU is increasing, and the heat generated in the processing speed is also increasing significantly.
In order not to reduce the frequency of the VGA card caused by high temperature.
Antiowinner’s TG thermal paste series products with low thermal resistance and high ability to fill the gap will quickly reduce the high temperature generated by GPU, In order to provide consumers with better operability and improve the service life of the display card.

TG Series -High Performance Thermal Grease

Power Transistor of VGA card thermal solution

In the complicated assembly process of the graphics card module, the traditional thermal conductive gap filler for the power transistor is made of thermal conductive silica gel.
However, due to the long length of the electric circular transistor and the soft material used, it is easy to have dislocation in the alignment of the bonding, resulting in rework and reattachment.
Antiowinner’s T-Gel product series will effectively provide a better assembly scheme. The materials can be accurately installed to the target position by air pressure extrusion with dispensing, and its low thermal resistance compression can effectively improve the effect of heat transfer.

T-Gel Series -Highly Performance Dispensing Thermal Conductive Gel

CPU air cooling module thermal solution

With the development and progress of CPU, its multi-core and thread design has significantly improved its computing efficiency.
The accompanying problem is that it generates a lot of heat. In order to avoid the CPU operation frequency reduction caused by high temperature, which will affect the operability of consumers, Antiowinner’s TG thermal paste series products, with its good filling capability, high thermal conductivity and low thermal resistance, are widely used in the cooling module of air cooling system, it will be able to greatly reduce the risk of computer not smoothly operation which cause by high temperature, and effectively improve the life of the CPU.

TG Series -High Performance Thermal Grease

CPU water cooling module thermal solution

With the improvement of CPU’s multi-core high-efficiency computing ability, the selection of heat sink is also advanced from the traditional air-cooled heat sink module to the water-cooled heat sink system.
In the position where the water-cooled joint connect with CPU, it is also necessary to match with the efficient heat conduction gap filling material.
TG series thermal conductive paste products of Antiowinner, with its extremely low thermal resistance benefit, can quickly transfer the high temperature generated by CPU working to the water cooling system.
In addition to improving the working ability of CPU, it can also make full use of the heat removal efficiency of water cooling module and prolong the service life of CPU.

TG Series -High Performance Thermal Grease

M.2 SSD Thermal Solution

With the development of SSD, on the premise of keeping high-capacity memory, the volume of the product itself has become an unwritten demand in the computer assembly market, and the memory slot of m.2 has also been produced.
In the operation of high-speed transmission, excellent heat dissipation is an indispensable solution for the integrated solid-state hard disk module, Antiowinner’s TCS thermal conductive silicone PAD series products use its good product compression and softness.
Driven by its self height thermal conductivity, it can effectively transfer the high temperature generated by high-speed transmission on solid-state hard disk, effectively extend the product life, and give consumers more smooth operation enjoyment.

TCS Series-High Performance Thermally Conductive Silicon PAD

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